Operating Instruction
1. BGA Removal process
1.1 Select Rework nozzle and Rework pallet and place on X-Y table of SRT machine in suitable direction.
1.2 Take PCBA that failed at BGA location and already baked place into the rework pallet.
1.3 Stick kapton tape (1 layer) at adjacent area around 4 sides to prevent solder splash and solder ball defect during site-dressing process in next step.
1.4 Cover heat protection shield at adjacent component around 4 sides and/or stick kapton tape (2 Layer) for header component (or other component which can not use heat shield) to protect the site effect during rework.
1.5 Attach the thermocouple with kapton tape (1 layer) on the PCB top side by distance 1 inch from BGA location.
1.6 Adjust the height of nozzle over PCB surface about 2 mm.
1.7 Select program for remove component by parameters setting in SRT machine.
1.8 Click Go button to start removal process.
2. Pad site-dressing & Visual Inspection
2.1 After BGA removal process, inspect pad damage by Microscope. (For big size board, must place the board into fixture before inspection).
2.2 Apply paste flux at all BGA pads.
2.3 Site dress BGA pads row when board still hot.
2.4 After pad site-dressing, inspect the criteria defect by Microscope 7X-40X
3. Solder paste printing
3.1 Using specific mini stencil and alignment with BGA pad then fix mini stencil by using kapton tape (1 Layer).
3.2 Print the solder paste by take a small amount of solder paste by squeegee (not over½ of Squeegee) then apply on mini stencil.
3.3 Remove kapton tape side by side and lift mini stencil.
3.4 After printing solder paste, cleaning mini stencil by Ultrasonic machine.
4. BGA replacement process by SRT machine
4.1 Select Rework nozzle and Rework pallet and place on X-Y table of SRT machine in suitable direction.
4.2 Take board that already print solder paste place into rework pallet.
4.3 Cover heat protection shield at adjacent components around 4 sides and/or stick
kapton tape (2 Layer) for header components (or other components which can not use heat shield) to protect the site effects.
4.4 Attach the thermocouple with kapton tape (1 layer) on the PCB top side by distance 1 inch from BGA rework location.
4.5 Adjust the height of nozzle over PCB surface about 2 mm.
4.6 Select program for replace component by parameters setting in SRT machine.
4.8 Click Go button to start BGA replacement process
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I like your post, for general BGA Rework Process you can get help from http://www.solder.net/technical-info/bga-rework-processes/.
ReplyDeleteHi Mochita! I like the post .This is really nice and I must say here that we also work in the same industry and offer various BGA Rework tools and training according to IPC standard. your blogs helps me a lot to increase my knowledge . Thanks for sharing.
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